全并行CMS高级数高精度TDI CMOS图像传感器

    Fully parallel CMS high-stage high-precision TDI CMOS image sensor

    • 针对高级数模拟域累加器因前级电路噪声导致信噪比(Signal-to-Noise Ratio, SNR)提升受限的核心技术瓶颈,提出了一种基于全并行相关多采样(Correlated Multi-Sampling, CMS)技术的时间延迟积分(Time Delay Integration, TDI)CMOS图像传感器模拟域累加器创新架构。通过抽象CMS技术的数学模型,并将其与TDI信噪比模型深度耦合,完成性能提升的系统性评估。提出了基于全并行CMS技术的模拟域累加器架构,分析寄生效应对累加精度的影响,在传统模拟域累加器基础上采用了极性反转开关与自适应正反馈电容来抑制寄生效应的补偿方法。该架构在保障TDI累加行频不受影响的前提下,以更紧凑的芯片面积实现电路噪声的有效抑制,提升了TDI CMOS图像传感器模拟域累加器的SNR性能。基于55 nm 标准CMOS工艺实现了2 048列128级TDI图像传感器的设计与验证,提取后端物理实现引入的寄生参数后,结果表明,在行频10.85 kHz的速度下,128级累加的SNR整体提升了27.962 dB,其中极性反转开关与自适应正反馈电容的方法提升了20.9 dB,相关多采样技术提升了7.062 dB。获得性能提升的同时,其每列功耗仅有301 μW,每列128级累加器的面积为0.361 mm2,CMS电路较传统结构面积减小40%以上,使所提出的累加器每列面积减小至98.5%。

       

      Abstract:
      Objective The time delay integration (TDI) CMOS image sensor improves the signal-to-noise ratio (SNR) by accumulating the same image signal over multiple exposures, making it widely applicable in high-SNR-demanding fields such as aerospace, satellite imaging, and semiconductor testing. To further enhance the circuit's SNR, the number of accumulation levels in the analog domain accumulators is increased. However, parasitic capacitance and circuit noise also increase with the higher accumulation stages, which limits the improvement of SNR. Traditional analog accumulators can no longer meet the requirements of such applications. To reduce the impact of parasitic effects on accumulation accuracy, a compensation method utilizing polarity inversion switches and adaptive positive feedback capacitors is introduced. Furthermore, in response to the core technical bottleneck caused by front-end circuit noise, which limits SNR enhancement in high-stage analog accumulators, an innovative architecture for the TDI CMOS image sensor's analog domain accumulator based on fully parallel correlated multi-sampling (CMS) technology is proposed.
      Methods CMS technology is integrated with the analog domain accumulator using shared capacitors, resulting in a fully parallel CMS-based architecture for the analog domain accumulator (Fig.4) and its circuit timing sequence (Fig.5). This architecture allows the input signal to be sampled and averaged multiple times while enabling signal transfer and accumulation based on its structural characteristics, without the need for additional buffers. The architecture is designed to effectively suppress circuit noise within a more compact chip area, while ensuring that the TDI accumulation line rate remains unaffected, thereby enhancing the SNR performance of the TDI CMOS image sensor analog domain accumulator. By abstracting the mathematical model of CMS technology (Fig.2) and deeply coupling it with the TDI SNR model, the circuit's SNR enhancement is optimized, and a systematic performance evaluation is conducted.
      Results and Discussions To evaluate the SNR improvement of the proposed architecture after its actual design, an analog domain accumulator based on fully parallel CMS technology was implemented in a 2048×128 TDI CMOS image sensor using a 55 nm CMOS process. Simulations comparing the ideal (Fig.9) and actual (Fig.10) SNR improvements show that the actual SNR improvement closely matches the ideal values, demonstrating a significant enhancement in the circuit’s SNR. Simulation of the circuit's effective accumulation order (Fig.11) reveals that the proposed circuit achieves a 128-order accumulation effect, equivalent to the 625.461-order effective accumulation result of the circuit in 10, significantly enhancing the circuit's effective accumulation order. The circuit's quality factor calculation indicates that it performs excellently in terms of power consumption, SNR, and line frequency (Tab.1). Additionally, image processing tests confirm that the circuit effectively suppresses low-frequency noise from the front-end circuit, leading to a noticeable improvement in SNR. This results in fewer imaging noise spots and clearer image quality.
      Conclusions An analog domain accumulator architecture based on fully parallel correlated multi-sampling technology is designed, utilizing shared capacitors to synchronize correlated multi-sampling and analog accumulation. This approach effectively suppresses circuit noise while maintaining the TDI accumulator's line frequency, achieving a significant improvement in circuit SNR and enabling a higher effective accumulation stage with a more compact chip area. The proposed method, implemented using a 55 nm standard CMOS process, is successfully applied in a 2048-column, 128-stage TDI image sensor. Post-layout simulation results show that, at a line frequency of 10.85 kHz, the SNR of the 128-stage accumulation improves by 27.962 dB. Of this, the polarity inversion switch and adaptive positive feedback capacitor method contribute 20.9 dB, while the CMS technology provides an additional 7.062 dB. The power consumption per column is 301 µW, with an area of 0.361 mm2 for the 128-stage accumulator per column. The CMS circuit reduces the area by more than 40% compared to traditional designs, reducing the area of each column of the proposed accumulator to 98.5%. The circuit effectively reduces noise and enhances the SNR, significantly improving imaging accuracy under low-light conditions.

       

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